A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing unit removably locatable in first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable. A retractable cover sheet assembly, under computer control, is positioned to form a sized opening, which may include a containment structure, prior to opening the tank lid to minimize dielectric fluid loss.