Invention Grant
- Patent Title: Electrochemical deposition systems
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Application No.: US16516714Application Date: 2019-07-19
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Publication No.: US11608563B2Publication Date: 2023-03-21
- Inventor: Arthur Keigler , Dave Guarnaccia , Demetrius Papapanaiyatou , Jon Hander , Robert Moon
- Applicant: ASMPT NEXX, INC.
- Applicant Address: US MA Billerica
- Assignee: ASMPT NEXX, INC.
- Current Assignee: ASMPT NEXX, INC.
- Current Assignee Address: US MA Billerica
- Agency: Ostrolenk Faber LLP
- Main IPC: C25D5/08
- IPC: C25D5/08 ; C25D17/00 ; C25D5/02 ; C25D21/10 ; C25D17/06

Abstract:
An electrochemical deposition system for depositing metal onto a workpiece, comprises a deposition chamber adapted to receive plating solution, a workpiece holder for holding a workpiece in a first plane, a shield holder for holding a shield in a second plane substantially parallel to the first plane, an agitation plate having a profiled surface to agitate plating solution, wherein the workpiece holder, shield holder and agitation plate are all adapted for insertion into and removal from the deposition chamber, and further comprising an actuator operable to change a relative distance between the workpiece holder and shield holder, in a direction normal to the first and second planes, while they are located within the deposition chamber.
Public/Granted literature
- US20210017661A1 ELECTROCHEMICAL DEPOSITION SYSTEMS Public/Granted day:2021-01-21
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