Invention Grant
- Patent Title: Suppressing thermally induced voltages for verifying structural integrity of materials
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Application No.: US17303867Application Date: 2021-06-09
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Publication No.: US11609203B2Publication Date: 2023-03-21
- Inventor: David H. Redinger , Christopher R. Yungers , Jennifer F. Schumacher
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Sriram Srinivasan
- Main IPC: G01N27/20
- IPC: G01N27/20 ; G01N33/38

Abstract:
The disclosure describes techniques for detecting a crack or defect in a material. The technique may include applying an electrical signal to a first electrode pair electrically coupled to the material. The technique also may include, while applying the electrical signal to the first electrode pair, determining a measured voltage between a second, different electrode pair. At least one electrode of the second, different electrode pair is electrically coupled to the material. The technique may further include determining a corrected measured voltage by suppressing a thermally induced voltage from the measured voltage and determining whether the material includes a crack or other defect based on the corrected measured voltage.
Public/Granted literature
- US20210293736A1 SUPPRESSING THERMALLY INDUCED VOLTAGES FOR VERIFYING STRUCTURAL INTEGRITY OF MATERIALS Public/Granted day:2021-09-23
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