Invention Grant
- Patent Title: Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display device
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Application No.: US16483990Application Date: 2018-02-06
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Publication No.: US11609493B2Publication Date: 2023-03-21
- Inventor: Takashi Gondaira , Makoto Tai
- Applicant: ARISAWA MFG. CO., LTD.
- Applicant Address: JP Joetsu
- Assignee: ARISAWA MFG. CO., LTD.
- Current Assignee: ARISAWA MFG. CO., LTD.
- Current Assignee Address: JP Joetsu
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2017-020628 20170207,JPJP2017-216564 20171109
- International Application: PCT/JP2018/004100 WO 20180206
- International Announcement: WO2018/147295 WO 20180816
- Main IPC: G03F7/00
- IPC: G03F7/00 ; C08F2/46 ; C08F2/50 ; C08G61/04 ; G03F7/004 ; C08K5/00 ; C08K5/29 ; C08K5/5397 ; C08L33/06 ; H05K3/28

Abstract:
This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80□ or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 μm, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R1, R2, X1, X2, and n are as defined in the description.)
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