Invention Grant
- Patent Title: Apparatuses, methods, and systems for thermomechanical protection of electronics including computer components and sensors
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Application No.: US16639714Application Date: 2017-09-20
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Publication No.: US11609614B2Publication Date: 2023-03-21
- Inventor: Ali Moradi , Joseph B. Petrini , Michael A. Schroeder , Shankar Devansenathipathy , Atul N. Hatalkar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/052525 WO 20170920
- International Announcement: WO2019/059906 WO 20190328
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; G01S7/481 ; G06F1/20 ; H05K7/20

Abstract:
Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.
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