Invention Grant
- Patent Title: Projection and distance segmentation algorithm for wafer defect detection
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Application No.: US17124472Application Date: 2020-12-16
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Publication No.: US11610296B2Publication Date: 2023-03-21
- Inventor: Xuguang Jiang , Juhwan Rha
- Applicant: KLA CORPORATION
- Applicant Address: US CA Milpitas
- Assignee: KLA CORPORATION
- Current Assignee: KLA CORPORATION
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/11 ; G06T7/136 ; G01N21/88 ; G01N21/95
Abstract:
A projection is determined in a semiconductor image, which can be an X projection and/or a Y projection. At least one threshold is applied to the projection thereby forming at least one segment within the region. A fine segment can be determined in the region using a distance value from the projection. Defect detection can be performed in one of the fine segments.
Public/Granted literature
- US20210217159A1 PROJECTION AND DISTANCE SEGMENTATION ALGORITHM FOR WAFER DEFECT DETECTION Public/Granted day:2021-07-15
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