Invention Grant
- Patent Title: Printed circuitry
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Application No.: US16605514Application Date: 2018-03-26
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Publication No.: US11610499B2Publication Date: 2023-03-21
- Inventor: Gideon Amir , Niv Shem Tov
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2018/024287 WO 20180326
- International Announcement: WO2019/190451 WO 20191003
- Main IPC: G09B5/06
- IPC: G09B5/06

Abstract:
In an example, printed circuitry comprises a digitally printed switch, the printed switch comprising a first contact element printed using conductive print agent on a first substrate portion and a second contact element printed using conductive print agent on a second substrate portion. An interposed non-conductive printed spacer element is overprinted on at least one of the first and the second substrate portions.
Public/Granted literature
- US20210287562A1 PRINTED CIRCUITRY Public/Granted day:2021-09-16
Information query