Invention Grant
- Patent Title: Low-leakage drain-programmed ROM
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Application No.: US17367248Application Date: 2021-07-02
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Publication No.: US11610633B2Publication Date: 2023-03-21
- Inventor: Xiao Chen , Chen-ju Hsieh , Sung Son , Chulmin Jung
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: G11C16/00
- IPC: G11C16/00 ; G11C16/10 ; G11C16/26 ; G11C17/12 ; G11C16/08 ; G11C16/04 ; G11C16/24

Abstract:
A drain programmed read-only memory includes a diffusion region that spans a width of a bitcell and forms a drain of a first transistor and a second transistor. A bit line lead in a metal layer adjacent the diffusion region extends across the width of the bitcell. A first via extends from an upper half of the bit line lead and couples to a drain of the first transistor. Similarly, a second via extends from a lower half of the bit line and couples to a drain of the second transistor.
Public/Granted literature
- US20230005546A1 LOW-LEAKAGE DRAIN-PROGRAMMED ROM Public/Granted day:2023-01-05
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