Invention Grant
- Patent Title: Coil device
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Application No.: US17088638Application Date: 2020-11-04
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Publication No.: US11610713B2Publication Date: 2023-03-21
- Inventor: Katsumi Kobayashi , Kouyu Ohi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-118957 20160615,JP2017-069891 20170331
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/29 ; H01F27/28

Abstract:
A coil device comprising, the core body having a coil core part and a core bottom face, and a coil part forming spiral conductive pathway around the coil core part. A metal electrode is formed at the core bottom face, and the wire ends which are the conductive pathway of the coil part are formed at the metal electrode, and a part of the surface of the metal electrode is covered by the conductive resin electrode.
Public/Granted literature
- US20210050135A1 COIL DEVICE Public/Granted day:2021-02-18
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