Invention Grant
- Patent Title: Slow wave inductive structure and method of forming the same
-
Application No.: US16689633Application Date: 2019-11-20
-
Publication No.: US11610714B2Publication Date: 2023-03-21
- Inventor: Hsiao-Tsung Yen , Cheng-Wei Luo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F21/12

Abstract:
A slow wave inductive structure includes a first substrate. The slow wave inductive structure further includes a first conductive winding over the first substrate. The slow wave inductive structure further includes a second substrate over the first substrate, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (μm) to about 2 μm, and the second substrate comprises polysilicon or doped silicon. The slow wave inductive structure further includes a second conductive winding on an opposite side of the second substrate from the first conductive winding.
Public/Granted literature
- US20200090849A1 SLOW WAVE INDUCTIVE STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2020-03-19
Information query