Invention Grant
- Patent Title: Method for producing semiconductor device
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Application No.: US17158694Application Date: 2021-01-26
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Publication No.: US11610779B2Publication Date: 2023-03-21
- Inventor: Kota Yasunishi , Yukihisa Ueno
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Kiyosu
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Kiyosu
- Agency: McGinn I.P. Law Group, PLLC.
- Priority: JPJP2020-023817 20200214
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L29/66

Abstract:
An ion implanted region is formed by implanting Mg ions into a predetermined region of the surface of the first p-type layer. Subsequently, a second n-type layer is formed on the first p-type layer and the ion implanted region. A trench is formed by dry etching a predetermined region of the surface of the second n-type layer until reaching the first n-type layer. Next, heat treatment is performed to diffuse Mg. Thus, a p-type impurity region is formed in a region with a predetermined depth from the surface of the first n-type layer below the ion implanted region. Since the trench is formed before the heat treatment, Mg is not diffused laterally beyond the trench. Therefore, the width of the p-type impurity region is almost the same as the width of the first p-type layer divided by the trench.
Public/Granted literature
- US20210257216A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Public/Granted day:2021-08-19
Information query
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