Invention Grant
- Patent Title: Method for introducing at least one cutout or aperture into a sheetlike workpiece
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Application No.: US15511272Application Date: 2015-08-07
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Publication No.: US11610784B2Publication Date: 2023-03-21
- Inventor: Norbert Ambrosius , Roman Ostholt
- Applicant: LPKF Laser & Electronics AG
- Applicant Address: DE Garbsen
- Assignee: LPKF Laser & Electronics AG
- Current Assignee: LPKF Laser & Electronics AG
- Current Assignee Address: DE Garbsen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: DE102014113339.0 20140916,DE102014116291.9 20141107
- International Application: PCT/DE2015/100333 WO 20150807
- International Announcement: WO2016/041544 WO 20160324
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/48 ; H01L23/498 ; B23K26/382 ; B23K26/0622 ; H05K3/00 ; B23K101/40 ; B23K103/00 ; H01L23/15

Abstract:
A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.
Public/Granted literature
- US20170256422A1 METHOD FOR INTRODUCING AT LEAST ONE CUTOUT OR APERTURE INTO A SHEETLIKE WORKPIECE Public/Granted day:2017-09-07
Information query
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