Invention Grant
- Patent Title: Semiconductor package and method of manufacturing semiconductor package
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Application No.: US17212364Application Date: 2021-03-25
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Publication No.: US11610786B2Publication Date: 2023-03-21
- Inventor: Taeyoung Kim , Seokhong Kwon , Wonyoung Kim , Jinchan Ahn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2020-0077095 20200624
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/56 ; H01L23/24 ; H01L23/00
Abstract:
A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.
Public/Granted literature
- US20210407821A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE Public/Granted day:2021-12-30
Information query
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