Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US17245079Application Date: 2021-04-30
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Publication No.: US11610790B2Publication Date: 2023-03-21
- Inventor: Kenji Kobayashi , Jun Sawashima , Yuta Nishimura , Akito Hatano , Motoyuki Shimai , Toyohide Hayashi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2015-029843 20150218,JPJP2015-035519 20150225,JPJP2015-035520 20150225,JPJP2015-035521 20150225,JPJP2015-064802 20150326
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.
Public/Granted literature
- US20210249279A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-08-12
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