Invention Grant
- Patent Title: Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer
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Application No.: US17063885Application Date: 2020-10-06
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Publication No.: US11610815B2Publication Date: 2023-03-21
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2019-186667 20191010
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/364 ; C09J7/35 ; C09J7/24 ; B23K26/40
Abstract:
A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.
Public/Granted literature
- US20210111074A1 WAFER PROCESSING METHOD Public/Granted day:2021-04-15
Information query
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