Invention Grant
- Patent Title: Heat-conductive sheet
-
Application No.: US16968975Application Date: 2019-02-14
-
Publication No.: US11610829B2Publication Date: 2023-03-21
- Inventor: Shigeru Koyano
- Applicant: SEKISUI POLYMATECH CO., LTD.
- Applicant Address: JP Saitama
- Assignee: SEKISUI POLYMATECH CO., LTD.
- Current Assignee: SEKISUI POLYMATECH CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2018-024575 20180214
- International Application: PCT/JP2019/005233 WO 20190214
- International Announcement: WO2019/160004 WO 20190822
- Main IPC: H01L23/36
- IPC: H01L23/36 ; B32B7/027 ; H01L23/42 ; H01L23/373 ; H05K7/20 ; B32B27/08 ; B32B27/20

Abstract:
A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.
Public/Granted literature
- US20210057304A1 HEAT-CONDUCTIVE SHEET Public/Granted day:2021-02-25
Information query
IPC分类: