Invention Grant
- Patent Title: Semiconductor device having a butted contact, method of forming and method of using
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Application No.: US17111074Application Date: 2020-12-03
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Publication No.: US11610901B2Publication Date: 2023-03-21
- Inventor: You Che Chuang , Chih-Ming Lee , Hsin-Chi Chen , Hsun-Ying Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/11
- IPC: H01L27/11 ; G11C5/06

Abstract:
A semiconductor structure includes a first transistor comprising a first gate structure over a first active region in a substrate. The semiconductor structure further includes a second active region in the substrate. The semiconductor structure further includes a first butted contact. The butted contact includes a first portion extending in a first direction and overlapping the second active region, and a second portion extending from the first portion in a second direction, different from the first direction, wherein the second portion directly contacts the first gate structure.
Public/Granted literature
- US20210091091A1 SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT, METHOD OF FORMING AND METHOD OF USING Public/Granted day:2021-03-25
Information query
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