Invention Grant
- Patent Title: Memory device and manufacturing method thereof
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Application No.: US17331936Application Date: 2021-05-27
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Publication No.: US11610907B2Publication Date: 2023-03-21
- Inventor: Wen-Shun Lo , Tai-Yi Wu , YingKit Felix Tsui
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/11524
- IPC: H01L27/11524 ; H01L27/11529 ; H01L29/788 ; H01L29/66 ; H01L21/266 ; H01L27/11531 ; H01L29/94

Abstract:
A memory device includes a substrate, a first transistor, a second transistor, and a capacitor. The first transistor is over the substrate and includes a select gate. The second transistor is over the substrate and connected to the first transistor in series, in which the second transistor includes a floating gate. The capacitor is over the substrate and connected to the second transistor, wherein the capacitor includes a top electrode, a bottom electrode in the substrate, and an insulating layer between the top electrode and the bottom electrode. The insulating layer includes nitrogen. A nitrogen concentration of the insulating layer increases in a direction from the top electrode to the bottom electrode.
Public/Granted literature
- US20220384465A1 MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-12-01
Information query
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