Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
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Application No.: US17207759Application Date: 2021-03-22
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Publication No.: US11610996B2Publication Date: 2023-03-21
- Inventor: Sheng-Fu Huang , Chung-Hsun Huang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/786 ; H01L29/66 ; H01L29/49 ; H01L21/033 ; H01L21/311 ; H01L21/285 ; H01L21/02 ; H01L21/768

Abstract:
A semiconductor structure and a method of forming the same are provided. In the semiconductor structure, contact spacers are formed at least on sidewalls of contact trenches in the substrate, so that the distance between the gate and the silicide layers disposed only on the bottom surfaces, rather than on the sidewalls and the bottom surfaces, of the contact trenches can be increased, and thus the current leakage induced by gate can be decreased.
Public/Granted literature
- US20210210638A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2021-07-08
Information query
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