Invention Grant
- Patent Title: Resistive random access memory device
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Application No.: US17405907Application Date: 2021-08-18
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Publication No.: US11611039B2Publication Date: 2023-03-21
- Inventor: Tsai-Hao Hung , Shih-Chi Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: G11C11/00
- IPC: G11C11/00 ; H01L45/00 ; G11C13/00 ; H01L27/24

Abstract:
A memory includes: a first electrode comprising a top boundary and a sidewall; a resistive material layer, disposed above the first electrode, that comprises at least a first portion and a second portion coupled to a first end of the first portion, wherein the resistive material layer presents a variable resistance value; and a second electrode disposed above the resistive material layer.
Public/Granted literature
- US20210384423A1 NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE Public/Granted day:2021-12-09
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