- Patent Title: Flexible electrically conductive pastes and devices made therewith
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Application No.: US16444304Application Date: 2019-06-18
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Publication No.: US11611157B2Publication Date: 2023-03-21
- Inventor: Hee Hyun Lee , Edmund Francis Schieffer, Jr. , Hoang Vi Tran
- Applicant: DU PONT CHINA LIMITED
- Applicant Address: US DE Wilmington
- Assignee: DU PONT CHINA LIMITED
- Current Assignee: DU PONT CHINA LIMITED
- Current Assignee Address: US DE Wilmington
- Agency: Dority & Manning, P.A.
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01R4/04 ; H01R43/00 ; H01R13/03
Abstract:
This invention provides a polymer thick film electrically conductive paste composition, comprising conductive metal powder, a resin blend of polyol and phenoxy resin, blocked aliphatic polyisocyanate and one or more polar, aprotic solvents. In one embodiment the paste composition is used to form electrically conductive adhesive. In another embodiment the paste composition is used to form an electrically conductive polymer thick film.
Public/Granted literature
- US20190386403A1 FLEXIBLE ELECTRICALLY CONDUCTIVE PASTES AND DEVICES MADE THEREWITH Public/Granted day:2019-12-19
Information query
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