Invention Grant
- Patent Title: Method of manufacturing terminal-equipped electrical wire and terminal-equipped electrical wire
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Application No.: US17199406Application Date: 2021-03-11
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Publication No.: US11611159B2Publication Date: 2023-03-21
- Inventor: Kei Sato
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JPJP2020-047458 20200318,JPJP2020-124832 20200722
- Main IPC: H01R4/18
- IPC: H01R4/18 ; H01R43/26 ; H01R43/02 ; H01R4/2404

Abstract:
A method of manufacturing a terminal-equipped electrical wire includes: inserting a core-wire exposed part of a core wire of an electrical wire at a terminal between inner wall surfaces of a pair of piece parts of a terminal fitting including a core-wire connection body formed of a bottom part and the piece parts protruding from both ends of the bottom part, and placing the core-wire exposed part on an inner wall surface of the bottom part; melting the core-wire exposed part and the core-wire connection body by emitting a laser beam to the core-wire exposed part and the core-wire connection body from a free end side of each piece part; and fixing the core-wire exposed part and the core-wire connection body melted by the laser beam, with the emission of the laser beam stopped.
Public/Granted literature
- US20210296792A1 METHOD OF MANUFACTURING TERMINAL-EQUIPPED ELECTRICAL WIRE AND TERMINAL-EQUIPPED ELECTRICAL WIRE Public/Granted day:2021-09-23
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