Invention Grant
- Patent Title: Rate splitting using first layers and second layers
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Application No.: US15733764Application Date: 2019-04-17
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Publication No.: US11611416B2Publication Date: 2023-03-21
- Inventor: Chenxi Hao , Yu Zhang , Chao Wei , Liangming Wu , Qiaoyu Li , Hao Xu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Priority: WOPCT/CN2018/083886 20180420
- International Application: PCT/CN2019/082972 WO 20190417
- International Announcement: WO2019/201262 WO 20191024
- Main IPC: H04L5/00
- IPC: H04L5/00

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a transmitter device may allocate data associated with a user equipment (UE), of two or more UEs, into at least one of a first part, a second part, or a combination thereof; multiplex the first part of the data associated with the UE with a first part of data associated with one or more other UEs, of the two or more UEs, to form multiplexed data; map the multiplexed data to a first set of layers; and map the second part of the data associated with the UE and a second part of the data associated with the one or more other UEs to a second set of layers. Numerous other aspects are provided.
Public/Granted literature
- US20210211249A1 RATE SPLITTING USING FIRST LAYERS AND SECOND LAYERS Public/Granted day:2021-07-08
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