Invention Grant
- Patent Title: Camera module
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Application No.: US17477287Application Date: 2021-09-16
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Publication No.: US11611688B2Publication Date: 2023-03-21
- Inventor: Sang Yeal Han
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2017-0084701 20170704,KR10-2017-0084702 20170704,KR10-2017-0084703 20170704,KR10-2017-0084704 20170704
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
The present embodiment relates to a camera module comprising a front body, a lens, a rear body, a first substrate, an image sensor, a second substrate, a connector and a cover, wherein the cover includes a bottom plate having a hole in which the connector is to be disposed, side plates extending from the bottom plate, and pressing unit disposed at the bottom plate and elastically supporting the connector, the connector includes a first surface facing the inner surface of the bottom plate of the cover, and a second surface extending from the first surface and disposed in the hole, and the pressing unit includes a first pressing part for pressing the first surface of the connector, and a second pressing part for pressing the second surface of the connector.
Public/Granted literature
- US20220006928A1 CAMERA MODULE Public/Granted day:2022-01-06
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