Invention Grant
- Patent Title: Blood conduit with stent
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Application No.: US16340645Application Date: 2017-10-10
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Publication No.: US11612475B2Publication Date: 2023-03-28
- Inventor: Jeng Wei
- Applicant: Jeng Wei , Tai-Yen Sun
- Applicant Address: TW Taipei; US OH South Euclid
- Assignee: Jeng Wei,Tai-Yen Sun
- Current Assignee: Jeng Wei,Tai-Yen Sun
- Current Assignee Address: TW Taipei; US OH South Euclid
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/IB2017/056247 WO 20171010
- International Announcement: WO2018/069828 WO 20180419
- Main IPC: A61F2/07
- IPC: A61F2/07

Abstract:
A blood conduit with stent has a flexible conduit body and an expandable stent structure. The conduit body has a first opening end through which only an inflow of a blood enters and a second opening end through which only an outflow of the blood leaves. The stent structure includes a plurality of threads adhered to the conduit body and expands in directions intersecting an axial direction of the conduit body. A boundary of one of the threads of the stent structure closest to the second opening end is away from the second opening end with a predetermined distance, thereby preventing blood back flow into the false lumen via a new tear.
Public/Granted literature
- US20200046487A1 BLOOD CONDUIT WITH STENT Public/Granted day:2020-02-13
Information query
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