Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US17045847Application Date: 2018-05-17
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Publication No.: US11613638B2Publication Date: 2023-03-28
- Inventor: Laurent Herschke , Maria del Carmen Querol Esparch
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2018/033103 WO 20180517
- International Announcement: WO2019/221733 WO 20191121
- Main IPC: B29C64/00
- IPC: B29C64/00 ; C08L23/12 ; B33Y10/00 ; B33Y70/00 ; B29C64/165 ; C08L53/00 ; C08L23/14 ; B22F12/82 ; B33Y80/00 ; B29C64/40 ; B29C64/386 ; B22F10/00 ; B22F10/85 ; B29C64/10 ; B33Y40/20 ; B33Y50/02 ; B33Y40/00 ; B29C64/307 ; B29C64/393 ; B29C64/30 ; B33Y50/00 ; B29C64/227 ; B22F12/00 ; B29C64/255 ; B29C64/182 ; B33Y40/10 ; B29C64/176 ; B33Y99/00 ; B29C64/20 ; B29C64/245 ; B29C64/25 ; B01D67/00 ; B33Y30/00 ; B29C64/205 ; B29K21/00 ; B29K23/00 ; B29K105/00 ; B33Y70/10
Abstract:
The present disclosure relates to a build material for 3D printing. The build material comprises polymeric particles comprising polypropylene and at least one elastomer. The polymeric particles comprise a surface-active coating.
Public/Granted literature
- US20210139685A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2021-05-13
Information query
