Invention Grant
- Patent Title: High heat-resistant composition and method of manufacturing three-dimensional substrate using the same
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Application No.: US16425120Application Date: 2019-05-29
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Publication No.: US11613651B2Publication Date: 2023-03-28
- Inventor: Jin Nyoung Heo , Hyuck Kang , Dae Hwan Kim , Jeong Su Oh , Jong Kap Jo , Yu Sik Jeon , Jae Seung Jeon
- Applicant: Samsung Display Co., Ltd. , KCC CORPORATION
- Applicant Address: KR Yongin-si; KR Seoul
- Assignee: Samsung Display Co., Ltd.,KCC CORPORATION
- Current Assignee: Samsung Display Co., Ltd.,KCC CORPORATION
- Current Assignee Address: KR Yongin-si; KR Seoul
- Agency: Cantor Colburn LLP
- Priority: KR10-2018-0062070 20180530
- Main IPC: C08L83/04
- IPC: C08L83/04 ; C08K3/013 ; C03C17/00 ; C08G63/695 ; C08K3/04 ; C08K3/22 ; C08K5/5419 ; C09D11/324
Abstract:
A heat-resistant composition including: a binder resin including at least two of a silicone-modified polyester resin, a siloxane compound, or a silanol compound; a pigment including at least two of iron cobalt chromite black spinel (ICCB), copper chromite black spinel (CCB), iron chromite manganese (ICM), or carbon black; and a catalyst.
Information query
