Invention Grant
- Patent Title: Adhesive composition, adhesive comprising same, and manufacturing method therefor
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Application No.: US16638401Application Date: 2018-08-22
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Publication No.: US11613679B2Publication Date: 2023-03-28
- Inventor: Hong Gu Hwang , Ick Kyung Sung , Du Hwan Kim , Jung Seok Hahn , Haeshin Lee , Dai Heon Lee
- Applicant: KOLON INDUSTRIES, INC. , KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul; KR Daejeon
- Assignee: KOLON INDUSTRIES, INC.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOLON INDUSTRIES, INC.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Seoul; KR Daejeon
- Agency: Harvest IP Law, LLP
- Priority: KR10-2017-0106364 20170823,KR10-2018-0097589 20180821
- International Application: PCT/KR2018/009654 WO 20180822
- International Announcement: WO2019/039858 WO 20190228
- Main IPC: C09J129/04
- IPC: C09J129/04 ; A61K47/32 ; A61K47/22 ; C09J11/08
Abstract:
The present invention relates to an adhesive composition comprising a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive comprising the same, and to a manufacturing method therefor and, more specifically, to an adhesive composition, which has little toxicity, can adhere even without a curing process unlike a conventional adhesive, enables the manufacturing of a gel by hydrogen binding characteristics between the polyvinyl alcohol compound and the water-soluble polyphenol compound, and retains adhesive properties in water.
Information query
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