Invention Grant
- Patent Title: Film forming apparatus and method of operating film forming apparatus
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Application No.: US17027409Application Date: 2020-09-21
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Publication No.: US11613811B2Publication Date: 2023-03-28
- Inventor: Jun Ogawa , Hiroyuki Wada
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-177576 20190927
- Main IPC: C23C16/458
- IPC: C23C16/458 ; C23C16/455 ; C23C16/452 ; C23C16/44 ; C23C16/52 ; C23C16/34

Abstract:
A film forming apparatus sequentially supplies a raw material gas of a compound containing chlorine and an element other than the chlorine, and a first reaction to form a fil. The film forming apparatus includes a rotary table, a raw material gas ejection port configured to eject the raw material gas to a first region, a reaction gas supply part configured to supply, to a second region, a first reaction gas and a second reaction gas that reacts with chlorine to generate a third reaction product, in order to prevent a second reaction product from being generated due to a reaction of the chlorine remaining in the vacuum container with air when performing the opening-to-air. The film forming apparatus further includes an atmosphere separation part, a first exhaust port and a second exhaust port, and a controller.
Public/Granted literature
- US20210095375A1 FILM FORMING APPARATUS AND METHOD OF OPERATING FILM FORMING APPARATUS Public/Granted day:2021-04-01
Information query
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