In a conventional radiation capturing device, such as an X-ray device or a CT scanner, a structured surface part, e.g. a scintillator array, is used that is manufactured by mechanical processing, e.g. by dicing and grinding. In order to modifying the scintillating properties of a scintillating material, further manufacturing steps, such as high temperature cycling like sintering etc., are performed in order to restore or at least improve the scintillating properties. This application proposes to form a structured surface part with a particle-in-binder structure containing scintillator or other radiation-relevant particles, using additive manufacturing with a photosensitive mixture to form a layer-wise structure. Therefore, subsequent manufacturing steps, such as sintering, can be omitted. The structured surface part is bendable.