Invention Grant
- Patent Title: Pressure calibration method and touch sensitive process apparatus and touch system implementing the method
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Application No.: US17530875Application Date: 2021-11-19
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Publication No.: US11614831B2Publication Date: 2023-03-28
- Inventor: Chin-Fu Chang , Shang-Tai Yeh
- Applicant: EGALAX_EMPIA TECHNOLOGY INC.
- Applicant Address: TW Taipei
- Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Priority: TW109146432 20201225
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044

Abstract:
A pressure calibration method, applicable to a touch panel which sequentially comprises a first electrode layer, an elastic dielectric layer and a second electrode layer, the first electrode layer includes multiple first electrodes in parallel to a first axis, the second electrode layer includes multiple second electrodes in parallel to a second axis, the pressure calibration method comprising: retrieving a depression event according to mutual capacitance sensing between the first electrodes and the second electrodes; finding a corresponding calibration area according to coordinate of the depression event; and calculating a calibrated pressure value according to a pressure sensing value of the depression event and a pressure calibration function of the corresponding calibration area.
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