Invention Grant
- Patent Title: Processing computational models in parallel
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Application No.: US16777729Application Date: 2020-01-30
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Publication No.: US11615287B2Publication Date: 2023-03-28
- Inventor: Byoungjoo Lee , Jemin Woo , Jinjong Lee , Jungsig Jun
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Lee, Hong, Degerman, Kang & Waimey PC
- Priority: KR10-2019-0163982 20191210
- Main IPC: G06N3/04
- IPC: G06N3/04 ; G06N3/10 ; G06N3/08

Abstract:
The present disclosure relates to an artificial intelligence chip for processing computations for machine learning models that provides a compute node and a method of processing a computational model using a plurality of compute nodes in parallel. In some embodiments, the compute node, comprises: a communication interface configured to communicate with one or more other compute nodes; a memory configured to store shared data that is shared with the one or more other compute nodes; and a processor configured to: determine an expected computational load for processing a computational model for input data; obtain a contributable computational load of the compute node and the one or more other compute nodes; and select a master node to distribute the determined expected computational load based on the obtained contributable computational load. Consequently, learning and inference can be performed efficiently on-device.
Public/Granted literature
- US20200250509A1 PROCESSING COMPUTATIONAL MODELS IN PARALLEL Public/Granted day:2020-08-06
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