Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US17548664Application Date: 2021-12-13
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Publication No.: US11615850B2Publication Date: 2023-03-28
- Inventor: Masanobu Shirakawa , Takuya Futatsuyama
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2018-175787 20180920
- Main IPC: G11C16/10
- IPC: G11C16/10 ; G11C16/04 ; G11C11/56 ; G11C16/34 ; H01L27/11582 ; H01L27/11565 ; H01L27/1157

Abstract:
According to one embodiment, a semiconductor memory device includes: a first memory cell; a second memory cell; a first word line; a second word line; and a first bit line. The device is configured to execute a first operation, a second operation, and a third operation to write data into the first memory cell. In the first operation, a first voltage is applied to the second word line. In the second operation, after the first operation, a second voltage higher than the first voltage is applied to the second word line. In the third operation, after the second operation, a third voltage higher than the second voltage is applied to the first word line, and a fourth voltage lower than both the second voltage and the third voltage is applied to the second word line.
Public/Granted literature
- US20220101924A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2022-03-31
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