Invention Grant
- Patent Title: Soft magnetic alloy powder and method for manufacturing same, as well as coil component made from soft magnetic alloy powder and circuit board carrying same
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Application No.: US16798870Application Date: 2020-02-24
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Publication No.: US11615902B2Publication Date: 2023-03-28
- Inventor: Yoko Orimo , Shinsuke Takeoka
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JPJP2019-036937 20190228,JPJP2019-207605 20191118
- Main IPC: H01F1/147
- IPC: H01F1/147 ; H01F27/255 ; H01F27/28 ; H05K1/18 ; C22C38/18 ; C22C38/06 ; C22C38/02 ; B22F1/00 ; B22F1/142

Abstract:
A soft magnetic alloy powder contains Fe, Si, and at least one of Cr and Al, as constituent elements, wherein, on the surface of each grain constituting the alloy powder, an oxide film is provided which is such that: it contains Si, as well as at least one of Cr and Al, as constituent elements; these elements are contained at higher percentages by mass than those in the alloy part inside the grain; and the content of Si, expressed in percentage by mass, is higher than the total content of Cr and Al. The soft magnetic metal powder can achieve a higher filling rate.
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