Invention Grant
- Patent Title: Method and device for producing pressure sensitive sensor
-
Application No.: US16894318Application Date: 2020-06-05
-
Publication No.: US11615926B2Publication Date: 2023-03-28
- Inventor: Keisuke Sugita , Masahiro Abe
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn I.P. Law Group, PLLC.
- Priority: JPJP2019-108118 20190610
- Main IPC: G01L1/00
- IPC: G01L1/00 ; H01H11/00

Abstract:
A method configured to produce a pressure-sensitive sensor composed of a cylindrical-shape body including therein a hollow portion along a longitudinal direction of that sensor, and being made of an elastic electrical insulating member, and a plurality of electrode wires arranged helically along an inner peripheral surface of the cylindrical-shape body and arranged in such a manner as to have no contact with each other. The method includes, with an extruder with a head, extrusion-molding the cylindrical-shape body while running the plurality of electrode wires into that head in such a manner that a periphery of the plurality of electrode wires is coated with the cylindrical-shape body, and taking up the cylindrical-shape body and the plurality of electrode wires ejected from the extruder while rotating the cylindrical-shape body and the plurality of electrode wires in a circumferential direction of the sensor, to thereby helically arrange the plurality of electrode wires.
Information query