Invention Grant
- Patent Title: Thin dual foil package including multiple foil substrates
-
Application No.: US16804943Application Date: 2020-02-28
-
Publication No.: US11615996B2Publication Date: 2023-03-28
- Inventor: Robert Faul
- Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Perkins Coie LLP
- Agent Michael A. Glenn
- Priority: DE102019202718.0 20190228
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/49 ; H01L23/552 ; H01L23/498 ; H01L21/56
Abstract:
A foil package includes a first foil substrate with a first and a second main surface, a second foil substrate with a first and a second main surface, wherein its first main surface is arranged facing the second main surface of the first foil substrate. The foil package includes at least one electronic device arranged between the first foil substrate and the second foil substrate and a first electrically conductive layer structure structured into a plurality of first partial areas arranged on the second main surface of the first foil substrate. The plurality of partial areas incompletely cover the second main surface of the first foil substrate. The at least one electronic device includes a terminal side and a side opposite to the terminal side.
Public/Granted literature
- US20200279785A1 THIN DUAL FOIL PACKAGE Public/Granted day:2020-09-03
Information query
IPC分类:
