Invention Grant
- Patent Title: Plurality of leads having a two stage recess
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Application No.: US17165032Application Date: 2021-02-02
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Publication No.: US11616005B2Publication Date: 2023-03-28
- Inventor: Koji Watanabe , Kentaro Kaneko , Hiroto Seki
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2020-019203 20200206
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/31

Abstract:
A lead frame includes: a frame body; a plurality of leads individually projecting from the frame body; and a recess formed across one surfaces of the leads adjacent to each other with the frame body therebetween, the recess including a first recess, and a second recess partially overlapping the first recess in a bottom surface thereof and having a smaller depth than the first recess.
Public/Granted literature
- US20210249340A1 LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LEAD FRAME Public/Granted day:2021-08-12
Information query
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