Invention Grant
- Patent Title: Integrated circuit package structure, integrated circuit package unit and associated packaging method
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Application No.: US17469831Application Date: 2021-09-08
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Publication No.: US11616017B2Publication Date: 2023-03-28
- Inventor: Yingjiang Pu , Hunt Hang Jiang , Xiuhong Guo
- Applicant: Chengdu Monolithic Power Systems Co., Ltd.
- Applicant Address: CN Chengdu
- Assignee: Chengdu Monolithic Power Systems Co., Ltd.
- Current Assignee: Chengdu Monolithic Power Systems Co., Ltd.
- Current Assignee Address: CN Chengdu
- Agency: Perkins Coie LLP
- Priority: CN202010947373.5 20200910
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/31 ; H01L23/532 ; H01L25/065 ; H01L23/00
Abstract:
An IC package structure and an IC package unit are disclosed. The IC package includes an array of metal wall grids formed into a panel, each one of the metal wall grids having a continuous and closed metal wall to surround an IC package unit with at least one IC chip/IC die disposed therein. Each IC chip/IC die has a top surface with a plurality of metal pads formed thereon. A panel-shaped metal layer is formed on entire back side of the panel of the array of metal wall grids and bonded to the metal wall of each metal wall grid. A panel-shaped rewiring substrate having a plurality of metal pillars is connected to each IC chip/IC die with each one of the plurality of metal pillars soldered with a corresponding one of the plurality of metal pads.
Public/Granted literature
- US20220077054A1 INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD Public/Granted day:2022-03-10
Information query
IPC分类:
