Invention Grant
- Patent Title: Semiconductor structure
-
Application No.: US17019956Application Date: 2020-09-14
-
Publication No.: US11616064B2Publication Date: 2023-03-28
- Inventor: Yong Li
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , SMIC New Technology Research and Development (Shanghai) Corporation
- Applicant Address: CN Shanghai; CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,SMIC New Technology Research and Development (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,SMIC New Technology Research and Development (Shanghai) Corporation
- Current Assignee Address: CN Shanghai; CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201710735050.8 20170824
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/417 ; H01L29/78 ; H01L29/66 ; H01L21/8238 ; H01L21/8234 ; H01L21/84

Abstract:
A semiconductor structure is provided. The semiconductor structure includes a base substrate including a semiconductor substrate having a PMOS region and an NMOS region and a plurality of fins on the semiconductor substrate, a gate layer across the plurality of fins by covering portions of top and sidewall surfaces of the fins, a P-type doped epitaxial layer formed in the fins at both sides of the gate layer in the PMOS region, an N-type doped epitaxial layer formed in the fins at both sides of the gate layer in the NMOS region, and an N-region mask layer formed on sidewall surfaces of the N-type doped epitaxial layer and covering the P-type doped epitaxial layer. A portion of the N-type doped epitaxial layer exposed by the N-region mask layer is processed by an N-type dopant segregated Schottky doping process.
Information query
IPC分类: