- Patent Title: Semiconductor device, solid-state imaging device, and camera system
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Application No.: US16553303Application Date: 2019-08-28
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Publication No.: US11616089B2Publication Date: 2023-03-28
- Inventor: Shunichi Sukegawa , Noriyuki Fukushima
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2010-127237 20100602
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/48 ; H01L23/498
Abstract:
Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing semiconductor chip disposed on the support substrate, wherein the imaging semiconductor chip and the image processing semiconductor chip are connected by through-vias, and interconnects formed on the support substrate.
Public/Granted literature
- US20200058692A1 SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND CAMERA SYSTEM Public/Granted day:2020-02-20
Information query
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