- Patent Title: Three-dimensional memory arrays, and methods of forming the same
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Application No.: US17833596Application Date: 2022-06-06
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Publication No.: US11616098B2Publication Date: 2023-03-28
- Inventor: Lingming Yang , Karthik Sarpatwari , Fabio Pellizzer , Nevil N. Gajera , Lei Wei
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L23/528 ; H01L45/00 ; H01L23/532

Abstract:
An example apparatus includes a three-dimensional (3D) memory array including a sense line and a plurality of vertical stacks. Each respective on of the vertical stacks includes a different respective portion of the sense line, a first memory cell coupled to that portion of the sense line, a second memory cell coupled to that portion of the sense line, a first access line coupled to the first memory cell and a second access line coupled to the second memory cell. The first and second access lines are perpendicular to the sense line.
Public/Granted literature
- US20220302212A1 THREE-DIMENSIONAL MEMORY ARRAYS, AND METHODS OF FORMING THE SAME Public/Granted day:2022-09-22
Information query
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