- Patent Title: Vertical transport field effect transistor with bottom source/drain
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Application No.: US17225327Application Date: 2021-04-08
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Publication No.: US11616140B2Publication Date: 2023-03-28
- Inventor: Heng Wu , Gen Tsutsui , Lan Yu , Ruilong Xie
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Robert Sullivan
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L27/088

Abstract:
A vertical field effect transistor structure having at least two vertically oriented fins extending from a substrate. The vertical field effect transistor structure further includes a first source/drain region disposed in the substrate between the two vertically oriented fins and under each of the fins. The outer ends of the first source/drain region are in contact with outer ends of the fins. A portion of the first source/drain region extends beyond the fins.
Public/Granted literature
- US20210226055A1 VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR WITH BOTTOM SOURCE/DRAIN Public/Granted day:2021-07-22
Information query
IPC分类: