Invention Grant
- Patent Title: Delay interpolator
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Application No.: US17506902Application Date: 2021-10-21
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Publication No.: US11616500B2Publication Date: 2023-03-28
- Inventor: Jeffrey Mark Hinrichs
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H03K5/134
- IPC: H03K5/134 ; H03K5/00

Abstract:
A delay interpolator includes pull-up devices coupled between a supply rail and a node, pull-down devices coupled between the node and a ground, and a first control circuit coupled to the pull-up devices, wherein the first control circuit is configured to receive a first signal, a second signal, and a first delay code, input the first signal to a programmable number of the pull-up devices based on the first delay code, and input the second signal to remaining ones of the pull-up devices. The delay interpolator also includes a second control circuit coupled to the pull-down devices, wherein the second control circuit is configured to receive the first signal, the second signal, and a second delay code, input the first signal to a programmable number of the pull-down devices based on the second delay code, and input the second signal to remaining ones of the pull-down devices.
Public/Granted literature
- US20220345122A1 DELAY INTERPOLATOR Public/Granted day:2022-10-27
Information query
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