Invention Grant
- Patent Title: Two-stage interleaving techniques for wireless communications
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Application No.: US16877188Application Date: 2020-05-18
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Publication No.: US11616599B2Publication Date: 2023-03-28
- Inventor: Alexandros Manolakos , Gabi Sarkis , Joseph Binamira Soriaga
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Priority: GR20190100309 20190718
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H04W72/04

Abstract:
Methods, systems, and devices for wireless communications are described in which a two-stage interleaving pattern may be provided for communication of coded information via a channel. The channel may have a channel bandwidth within a bandwidth part (BWP) of a total frequency bandwidth, and the two-stage interleaving pattern may provide a first interleaving pattern of resource blocks within an allocated set of user equipment (UE) resources and a second interleaving pattern of resource blocks within the BWP. The two-stage interleaving pattern may be based on the first interleaving pattern being initially applied to resource blocks within the allocated set of UE resources, and the second interleaving pattern being subsequently applied to resource blocks within the BWP. Signaling to indicate a type of interleaving to be applied to a communication may be provided in semi-static signaling, dynamic signaling, or combinations thereof.
Public/Granted literature
- US20210021374A1 TWO-STAGE INTERLEAVING TECHNIQUES FOR WIRELESS COMMUNICATIONS Public/Granted day:2021-01-21
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