Invention Grant
- Patent Title: Power optimized uplink grant skipping
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Application No.: US17211661Application Date: 2021-03-24
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Publication No.: US11617189B2Publication Date: 2023-03-28
- Inventor: Michel Evan Chauvin , Arnaud Meylan , Bao Vinh Nguyen , Peng Wu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H04W72/14
- IPC: H04W72/14 ; H04W72/1268

Abstract:
A method of wireless communication by a user equipment (UE) includes receiving a number of uplink grants from a base station. The method further includes estimating a payload size for data to be transmitted from a UE buffer for a number of logical channels. The payload size corresponds to a sum of a number of data bytes to be transmitted and an amount of overhead bytes to be transmitted. The method still further includes determining a subset of the number of uplink grants to use for uplink transmission based on reducing a total padding size associated with transmitting the payload size, for each combination of the number of uplink grants. The method also includes transmitting the data from the UE buffer within a number of transport blocks, to the base station. The number of transport blocks corresponds to the subset of the number of uplink grants.
Public/Granted literature
- US20220312443A1 POWER OPTIMIZED UPLINK GRANT SKIPPING Public/Granted day:2022-09-29
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