Invention Grant
- Patent Title: Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board
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Application No.: US17050624Application Date: 2019-04-22
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Publication No.: US11617261B2Publication Date: 2023-03-28
- Inventor: Akihiro Yamauchi , Eiichiro Saito , Kouichi Aoki
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-087727 20180427
- International Application: PCT/JP2019/016958 WO 20190422
- International Announcement: WO2019/208476 WO 20191031
- Main IPC: B32B15/08
- IPC: B32B15/08 ; C08J5/24 ; B32B15/20 ; C08K3/26 ; C08K3/22 ; H05K1/03 ; C08L63/00 ; H01L23/373 ; H05K7/20
Abstract:
A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.
Public/Granted literature
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