Invention Grant
- Patent Title: Circuit board and method for manufacturing the same
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Application No.: US17335059Application Date: 2021-05-31
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Publication No.: US11617263B2Publication Date: 2023-03-28
- Inventor: Lin-Jie Gao , Yong-Chao Wei
- Applicant: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen; CN Qinhuangdao; TW New Taipei
- Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,GARUDA TECHNOLOGY CO., LTD.
- Current Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,GARUDA TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen; CN Qinhuangdao; TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN202110402159.6 20210414
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H05K3/06 ; H05K3/30 ; H05K3/42 ; H05K3/46 ; H01L21/768 ; H01L23/48 ; H01L23/498 ; G02B6/10 ; H05K3/00 ; H05K1/05 ; H05K3/34
Abstract:
A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.
Public/Granted literature
- US20220338348A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-10-20
Information query
