A heat dissipating plate includes a casing, a capillary structure layer, a support structure, and heat dissipating liquid. The casing includes a first substrate and a second substrate, which is disposed opposite to the first substrate to form a non-vacuum sealed cavity. The capillary structure layer is disposed in a first region of the non-vacuum sealed cavity and defines a first flow space. The support structure is disposed in a second region of the non-vacuum sealed cavity and defines a second flow space. The heat dissipating liquid is disposed in the non-vacuum sealed cavity, the liquid amount of which is more than 50% of the total capacity of the first flow space and the second flow space, and flows between the first flow space and the second flow space. The invention also provides a method for manufacturing the heat dissipation plate and an electronic device having the heat dissipation plate.