Invention Grant
- Patent Title: Biomaterials for enhanced implant-host integration
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Application No.: US16589768Application Date: 2019-10-01
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Publication No.: US11617817B2Publication Date: 2023-04-04
- Inventor: Christopher S. Chen , Jan D. Baranski , Ritika Chaturvedi , Michael T. Yang , Kelly Stevens , Sangeeta Bhatia
- Applicant: The Trustees of the University of Pennsylvania , Massachusetts Institute of Technology
- Applicant Address: US PA Philadelphia; US MA Cambridge
- Assignee: The Trustees of the University of Pennsylvania,Massachusetts Institute of Technology
- Current Assignee: The Trustees of the University of Pennsylvania,Massachusetts Institute of Technology
- Current Assignee Address: US PA Philadelphia; US MA Cambridge
- Agency: McCarter & English, LLP
- Main IPC: A61L27/50
- IPC: A61L27/50 ; A61K35/44 ; A61L27/22 ; A61L27/24 ; A61L27/38 ; A61L27/40 ; A61L27/36

Abstract:
The present disclosure provides patterned biomaterials having organized cords and extracellular matrix embedded in a 3D scaffold. According, the present disclosure provides compositions and applications for patterned biomaterials. Pre-patterning of these biomaterials can lead to enhanced integration of these materials into host organisms, providing a strategy for enhancing the viability of engineered tissues by promoting vascularization.
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