Invention Grant
- Patent Title: Toolless lead connector assembly
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Application No.: US16604383Application Date: 2018-03-14
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Publication No.: US11617892B2Publication Date: 2023-04-04
- Inventor: Rajesh V. Iyer , Randy S. Roles , Erik R. Scott , Andrew J. Thom
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Mueting Raasch Group
- International Application: PCT/US2018/022431 WO 20180314
- International Announcement: WO2018/194770 WO 20181025
- Main IPC: A61N1/375
- IPC: A61N1/375 ; H01R13/52 ; H01R13/59

Abstract:
A lead connector assembly includes a lead receptacle, a sleeve, and a handle for coupling to a medical lead. The lead receptacle has an inner surface and an opening configured to receive the lead. The sleeve is deflectable by the inner surface of the lead receptacle. The sleeve has a distal end portion defining a first outer diameter to engage the lead in a locked position and a second outer diameter greater than the first diameter in an unlocked position. The handle is coupled to the lead receptacle and a proximal end portion of the sleeve to move the sleeve axially in both directions along the longitudinal axis relative to the lead receptacle. The lead connector assembly retains the lead in the locked position. The lead receptacle is couplable to a medical device housing.
Public/Granted literature
- US20200155853A1 TOOLLESS LEAD CONNECTOR ASSEMBLY Public/Granted day:2020-05-21
Information query
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